From November 30 to December 1, 2019, the first elite challenge competition for integrated circuit EDA design was held in jiangbei new district, nanjing. 104 teams from 41 universities across the country participated in the competition. Seven teams were organized by BiCASL lab to participate in the competition on behalf of the school. All of them reached the finals and won 2 second prizes, 5 third prizes and 2 special enterprise awards.
From November 25 to 27, "IEEE CAS Seasonal School on ai-driven Circuit, System,and EDA Tools", jointly sponsored by the department of micro-electronics and artificial intelligence research institute of Shanghai jiao tong university, was successfully launched in the building of School of microelectronics of Shanghai jiao tong university.
From October 16 to 19, 2019, teachers wang guoxing and li yongfu of BiCASL of micro-nano electronics led ma yi and wen yizhen to attend the BioCAS 2019 academic conference held in nara, Japan.
Congratulations to BiCASL students on winning 1 first prize (warm blood basketball team), 2 second prizes (ideking 2.0 team and cantalone guardian spirit team) and the prizes of creation in the second "huawei cup" creation competition in 2019!
Ahmed Reda Mohamed, Yue Gao and Tao He attended the ISCAS (IEEE International Symposium on Circuits and Systems) on 26th-29th May, 2019.
On March 19, 2019, Zhou Fei, a master student of the BiCASL Laboratory of the Department of Micro-Nano Electronics, Shanghai Jiaotong University, attended the academic conference of China International Semiconductor Technology Conference (CSTIC 2019) held in Pudong, Shanghai.
2019年2月19日，上海交通大学微纳电子学系BiCASL实验室博士生刘博晓参加了在美国旧金山举办的国际固态电路会议 (ISSCC 2019)学术会议
Prof. Wang has been elected as Vice President Financial Activities of IEEE Circuits and Systems Society (CASS) for the term 2019-2020.
Congratulations on the acceptance of our lab member LIU Boxiao's paper titled “A 13-channel 1.53mW 11.28mm^2 Electrical Impedance Tomography SoC Based on Frequency Division Multiplexing with 10x throughout reduction " to be published at the 2019 IEEE International Solid-State Circuits Conference.